Google Quantum AI is working to build a large-scale quantum computer capable of complex, error-corrected computations and solving classically intractable problems. The Fabrication Backend Process Engineer will develop and manufacture quantum processor devices by leading die preparation, hybridization, characterization, bonding, and backend process optimization activities.
Partner closely with other teams (e.g., design, test, frontend, packaging) to integrate new backend modules into devices, develop and refine device probing, packaging, and measurement methodologies, and ensure successful product delivery and customer satisfaction
Lead the sustainment and development of die singulation, die preparation, device hybridization modules and device characterization
Operate and maintain associated equipment to ensure optimal process outcomes and provide rapid, expert troubleshooting of process and equipment issues to minimize downtime and maintain production goals
Design, build, and maintain backend process infrastructure to enhance efficiency, organization, and scalability. Implement standardized work practices and optimize workflows for streamlined operations
Analyze process data to identify trends, improve stability, and drive continuous yield improvement
Qualification
Required
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, Physics, or a specialized field (e.g., Optics, Sensors, Audio/DSP, etc.), or equivalent practical experience
1 year of experience in a wafer level or die level cleanroom environment
1 year of experience with one or more of the following: SPC (statistical process control), Electrical test (Probing), Metrologies (SEM, XPS, Interferometry), or Failure analysis
1 year of experience in hybridization techniques, including flip chip bonding, die handling and post bonding measurement
Preferred
Master's degree or PhD in Electrical Engineering, Computer Engineering, Physics, or a related field (e.g., Optics, Sensors, Audio/DSP)
Experience with developing novel bump materials, scaling up die sizes, flip-chip bonding or designing robust structural bonding solutions
Experience with characterization techniques including SEM, XPS, confocal microscopy, and interferometry
Experience with statistical process control and failure analysis activities
Experience with data analysis and visualization tools such as JMP, Python, or SQL
Benefits
15% bonus target
Equity
Benefits
Google specializes in internet-related services and products, including search, advertising, and software. It is a sub-organization of Alphabet.
